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Metal material：Aluminium, copper

Copper foil thickness：≤6 OZ

Copper layers：Single-sided, double sided, multilayer metal core

Thermal conductivity：2-12w/m?k

Material：Thermal conductivity (0.3-2W/m?k)

Thermal pad treatment：Flat, Sinking

Outer layer copper(base)：0.5-18oz

Copper base thickness：0.8-3.2mm

Bus bar material：Pure copper

Min conductor space：0.8mm

Copper thickness：1.0mm-3.0mm

Board thickness：2.0mm-10.0mm